ePac Flexible Packaging Joins Open Invention Network

ePac is excited to announce that the company is the newest member of the Open Invention Network (OIN). OIN is the largest patent non-aggression community in the world, with members such as Sony, IBM, Google, and Toyota. All OIN members agree to cross-license other members under any patent claims they own or control that are essential to the Linux System Definition (LSD).

Parag Patel, ePac’s CIO said: “We’re proud to become a member of OIN and join an impressive group of global companies in doing so. As many already know, ePac is a unique company focused on helping SMB brands grow, something no other flex pack company has ever done before. In charting our path, innovative technology is at the core of who we are, and we look forward to the collaboration that’s possible through OIN.” 

Added Jack Knott, ePac’s CEO: “Since opening our first manufacturing facility, our mission has been clear. It is to help give back to the communities we serve and contribute to the creation of a more sustainable, circular economy. Technology sharing is part of this. By joining OIN, we are now part of a world community of companies having this vision.”

Click here to read the full press release.